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Transferencia Forward inducida por láser para Flip-chip de embalaje de muñones individuales
JoVE Journal
Engineering
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JoVE Journal Engineering
Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
DOI:

08:21 min

March 20, 2015

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Chapters

  • 00:05Title
  • 01:48Micro-bumping Using Laser-induced Forward Transfer
  • 03:52Chip to Substrate Thermo-compression Bonding and Encapsulation of the Bonded Assembly
  • 05:23Characterization of the Bonded Vertical-cavity Surface-emitting Lasers
  • 06:28Results:A Typical Light-current-voltage Curve Recorded from a Flip-chip Bonded Vertical-cavity Surface-emitting Laser Chip
  • 07:50Conclusion

Summary

Automatic Translation

Se demuestra el uso de la transferencia (LIFT) técnica Forward inducida por láser para el montaje flip-chip de componentes optoelectrónicos. Este enfoque proporciona una, rentable y de baja temperatura simple, solución rápida y flexible para chocar de paso fino y unión en el chip escala para alcanzar circuitos de alta densidad para aplicaciones optoelectrónicas.

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