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Chapters
- 00:05Title
- 01:48Micro-bumping Using Laser-induced Forward Transfer
- 03:52Chip to Substrate Thermo-compression Bonding and Encapsulation of the Bonded Assembly
- 05:23Characterization of the Bonded Vertical-cavity Surface-emitting Lasers
- 06:28Results:A Typical Light-current-voltage Curve Recorded from a Flip-chip Bonded Vertical-cavity Surface-emitting Laser Chip
- 07:50Conclusion
Vi demonstrere brugen af Laser-induceret Forward Transfer (LIFT) teknik til flip-chip samling af optoelektroniske komponenter. Denne fremgangsmåde giver en enkel, omkostningseffektiv, lav temperatur, hurtig og fleksibel løsning for fine pitch bumpe og limning på chip-skala for at opnå høj tæthed kredsløb til optoelektroniske applikationer.
