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Rendering SiO2/Si Surfaces Omniphobic by Carving Gas-Entrapping Microtextures Comprising Reentrant and Doubly Reentrant Cavities or Pillars
JoVE Journal
Engineering
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JoVE Journal Engineering
Rendering SiO2/Si Surfaces Omniphobic by Carving Gas-Entrapping Microtextures Comprising Reentrant and Doubly Reentrant Cavities or Pillars

Rendering SiO2/Si Surfaces Omniphobic by Carving Gas-Entrapping Microtextures Comprising Reentrant and Doubly Reentrant Cavities or Pillars

DOI:
10.3791/60403-v

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08:02 min

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February 11, 2020

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, , , , , ,
1Water Desalination and Reuse Center (WDRC), Biological and Environmental Science and Engineering (BESE) Division,King Abdullah University of Science and Technology (KAUST), 2Core Labs,King Abdullah University of Science and Technology (KAUST)

Chapters

  • 00:04Introduction
  • 01:08Cavity Design and Wafer Cleaning
  • 02:17Photolithography
  • 03:15Silica (SiO2) and Silicon (Si) Layer Etching
  • 04:30Thermal Oxide Growth and Etching
  • 06:00Results: Representative Wetting Behaviors of Gas-Entrapping Microtextures (GEMs)
  • 07:08Conclusion

Summary

Automatic Translation

Automatic Translation

This work presents microfabrication protocols for achieving cavities and pillars with reentrant and doubly reentrant profiles on SiO2/Si wafers using photolithography and dry etching. Resulting microtextured surfaces demonstrate remarkable liquid repellence, characterized by robust long-term entrapment of air under wetting liquids, despite the intrinsic wettability of silica.

Tags

Keywords: SiO2/Si SurfacesOmniphobicGas-entrapping MicrotexturesReentrant CavitiesDoubly Reentrant CavitiesPillarsPhotolithographyDry EtchingMicrofabricationSilicon WaferThermal OxidePiranha SolutionHexamethyldisilazanePhotoresistSpin CoatingUV Exposure

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