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JoVE Journal
Engineering

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Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
 

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding

Article DOI: 10.3791/51179
January 9th, 2014

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Summary January 9th, 2014

A method for permanently bonding two silicon wafers so as to realize a uniform enclosure is described. This includes wafer preparation, cleaning, RT bonding, and annealing processes. The resulting bonded wafers (cells) have uniformity of enclosure ~1%1,2. The resulting geometry allows for measurements of confined liquids and gasses.

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