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硫酸铜镀液中铜离子的积累与分析
JoVE Journal
Chemistry
This content is Free Access.
JoVE Journal
Chemistry
Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution
Please note that all translations are automatically generated.
Click here for the English version.
硫酸铜镀液中铜离子的积累与分析
DOI:
10.3791/59376-v
•
07:00 min
•
March 20, 2019
•
Toshiaki Koga
,
Yoshitaro Sakata
,
Nao Terasaki
1
Advanced Manufacturing Research Institute, Department of Electronics and Manufacturing
,
National Institute of Advanced Industrial Science and Technology (AIST)
Chapters
00:04
Title
01:00
Formation of the Cu(I) in The Plating Solution
02:48
Quantitative Measurement of the Cu(I)
03:46
Injection Measurement of Cu(I) and BCS Color Reaction Curves
04:46
Results: Analysis of the Cuprous Ions from the Copper Sulfate Plating Solution
06:17
Conclusion
Summary
Automatic Translation
English (Original)
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Automatic Translation
本文介绍了硫酸铜镀液中铜离子的积累, 并在定量测量的基础上进行了分析。本实验再现了镀液中铜离子的积累过程。
Tags
Copper Sulfate
Plating Solution
Monovalent Copper
Quantification
Optical Evaluation
Nitrogen Gas
Copper Plate
Platinum Plate
Power Supply
UV-Vis Spectrophotometer
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