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Chemistry
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硫酸銅めっき液の銅イオンの蓄積・分析
JoVE Journal
Chemistry
This content is Free Access.
JoVE Journal
Chemistry
Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution
Please note that all translations are automatically generated.
Click here for the English version.
硫酸銅めっき液の銅イオンの蓄積・分析
DOI:
10.3791/59376-v
•
07:00 min
•
March 20, 2019
•
Toshiaki Koga
,
Yoshitaro Sakata
,
Nao Terasaki
1
Advanced Manufacturing Research Institute, Department of Electronics and Manufacturing
,
National Institute of Advanced Industrial Science and Technology (AIST)
Chapters
00:04
Title
01:00
Formation of the Cu(I) in The Plating Solution
02:48
Quantitative Measurement of the Cu(I)
03:46
Injection Measurement of Cu(I) and BCS Color Reaction Curves
04:46
Results: Analysis of the Cuprous Ions from the Copper Sulfate Plating Solution
06:17
Conclusion
Summary
Automatic Translation
English (Original)
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Automatic Translation
ここでは、硫酸銅めっきモデル実験の定量的な測定に基づく液中の銅イオンの蓄積を説明します。この実験は、めっき浴中の銅イオンの蓄積過程を再現します。
Tags
Copper Sulfate
Plating Solution
Monovalent Copper
Quantification
Optical Evaluation
Nitrogen Gas
Copper Plate
Platinum Plate
Power Supply
UV-Vis Spectrophotometer
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