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金属辅助多孔硅和固体硅晶圆的电化学纳米压印
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Engineering
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JoVE Journal Engineering
Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers
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金属辅助多孔硅和固体硅晶圆的电化学纳米压印

English

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3,755 Views

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09:18 min

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February 08, 2022

DOI:

10.3791/61040-v

DOI:
10.3791/61040-v

•

09:18 min
February 08, 2022

•

4 Views
, , ,
1The Polytechnic School,Arizona State University

Summary

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提出了一种金属辅助化学印迹的方案，将形状精度低于20 nm的3D微尺度特征印制到固体和多孔硅晶圆中。

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Cite this Article

Sharstniou, A., Niauzorau, S., Junghare, A., Azeredo, B. P. Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers. J. Vis. Exp. (180), e61040, doi:10.3791/61040 (2022).

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