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金属辅助多孔硅和固体硅晶圆的电化学纳米压印
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JoVE Journal
Engineering
Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers
Please note that all translations are automatically generated.
Click here for the English version.
金属辅助多孔硅和固体硅晶圆的电化学纳米压印
DOI:
10.3791/61040-v
•
09:18 min
•
February 08, 2022
•
Aliaksandr Sharstniou
,
Stanislau Niauzorau
,
Ashlesha Junghare
,
Bruno P. Azeredo
1
The Polytechnic School
,
Arizona State University
Chapters
00:05
Introduction
01:19
Mac-imprint Stamp Preparation
02:43
Photoresist Ultraviolet (UV) Nanoimprinting
04:05
Gold and Silver/Gold Catalyst Thin Film Deposition
05:17
Silver/Gold Catalyst Thin Film Dealloying
06:01
Mac-imprint Operation
07:33
Results: Representative Au Porous Stamp and Si Mac-imprint Imaging
08:31
Conclusion
Summary
Automatic Translation
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Automatic Translation
提出了一种金属辅助化学印迹的方案,将形状精度低于20 nm的3D微尺度特征印制到固体和多孔硅晶圆中。
Tags
Metal-assisted Electrochemical Nanoimprinting
Porous Silicon
Solid Silicon
Hierarchical Microstructures
Metasurface-based Microoptic Elements
Waveguide Technologies
Optical Biosensors
Infrared Optical Devices
III-V Semiconductors
Stamp To Substrate Tip And Tilt Alignment
RCA-1 Solution
PFOCS
PDMS
UV Nanoimprinting
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